Cooling device, in which converters or rectifiers or other...

H - Electricity – 05 – K

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H05K 7/20 (2006.01) H01L 23/427 (2006.01) H01L 23/467 (2006.01)

Patent

CA 1215458

Abstract of the Disclosure: Cooling device for semiconductor components, including a chamber for receiving semiconductor components, boiling liquid disposed in the chamber for immersing the semiconductor components, means connected to the aid chamber for supplying a cooling air to eliminate a temperature rise of the aid boiling liquid and to remove a maximum power loss at a normal maximum ambient tempera- ture, a thermal energy accumulator connected to the chamber, and means for switching off the aid cooling air supply means and switching on the thermal energy accumulator if the ambient temper- ature of the cooling air rises.

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