Cooling head for integrated circuit

Details Cooling head for integrated circuit Cooling head for integrated circuit

H - Electricity

01

L

356/113

H01L 23/34 (2006.01) H01L 23/433 (2006.01)

Patent

CA 2008738

COOLING HEAD FOR INTEGRATED CIRCUIT ABSTRACT OF THE DISCLOSURE A cooling head projected from an underside of a cooling plate (11), wherein a heat-conductive plate (17) is fixed on the free end of the cooling head and a nozzle (19) is fixed in the interior of the cooling head. A cooling medium is fed to the heat-conductive plate (17) through the nozzle (19), to thereby circulate within the interior of the cooling head and quench heat generated by an integrated circuit element (4), by a heat exchange through the heat-conductive plate (17). An inwardly extending baffle (20a) is provided in the interior of the cooling head above the heat-conductive plate (17), to cover the peripheral area of the heat-conductive plate (17) so that a rising current of the cooling medium derived from a primary jet (S) fed from the nozzle (19) and impinging on the heat-conductive plate (17) is converted to vortices (W) circulating between the central area and the peripheral area of the heat-conductive plate (17). According to this structure, the cooling efficiency of the cooling head is improved over the entire surface of the heat-conductive plate (17).

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