Cooling method and apparatus

Details Cooling method and apparatus Cooling method and apparatus

H - Electricity

01

S

H01S 5/024 (2006.01) H01L 23/427 (2006.01) H01L 33/00 (2006.01)

Patent

CA 2533155

A method and apparatus for cooling an electronic component, such as an optoelectronic device, is described. The method involves arranging a porous material to be able to receive heat from the electronic component and removing heat from the porous material as a result of vaporisation of a coolant delivered to the porous material. In this manner, a temperature gradient is generated that causes heat to flow from the electronic device to the porous material, resulting in the electronic device being cooled.

L'invention concerne un procédé et un appareil de refroidissement permettant de refroidir un composant électronique, tel qu'un dispositif optoélectronique. Ledit procédé consiste à disposer un matériau poreux de sorte qu'il puisse recevoir la chaleur du composant électronique et à évacuer la chaleur du matériau poreux sous l'effet de la vaporisation d'un réfrigérant distribué sur le matériau poreux. Ainsi, un gradient de température est généré, lequel amène la chaleur à circuler du dispositif électronique vers le matériau poreux, le dispositif électronique étant ainsi refroidi.

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