Cooling structure for electronic circuit package

Details Cooling structure for electronic circuit package Cooling structure for electronic circuit package

H - Electricity

01

L

H01L 23/473 (2006.01) H01L 23/433 (2006.01)

Patent

CA 2088747

A cooling structure which is used for forced cooling of an electronic circuit package such as an integrated circuit is disclosed. The cooling structure comprises a tubular fin member having many through-holes of small diameter, a flat plate member which is joined to and seals one end of the tubular fin member, a lid member attached to the other end of the tubular fin member and a pipe member used as a nozzle from which coolant is jetted towards the plate member. Both the tubular fin member and the plate member are made of a material having high heat conductivity. The pipe member extends through the lid member or is inserted through an opening formed in the lid member. The electronic circuit package is fixed to the plate member.

tructure de refroidissement utilisée pour le refroidissement forcé d'un ensemble de circuits électroniques, tel un circuit intégré. La structure de refroidissement comprend un élément tubulaire à ailettes percé de plusieurs trous de petit diamètre, un élément plat qui scelle une extrémité de l'élément tubulaire à ailettes auquel il est assemblé, un élément couvercle fixé à l'autre extrémité de l'élément tubulaire à ailettes et un élément tuyau servant d'ajutage au moyen duquel on fait gicler l'agent de refroidissement vers l'élément plat. L'élément tubulaire à ailettes et l'élément plat sont tous deux faits d'un matériau à haute conductivité thermique. L'élément tuyau s'étend à travers l'élément couvercle ou est introduit par une ouverture pratiquée dans l'élément couvercle. L'ensemble de circuits électroniques est fixé à l'élément plat.

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