Cooling structure for electronic circuit package

Details Cooling structure for electronic circuit package Cooling structure for electronic circuit package

H - Electricity

01

L

H01L 23/473 (2006.01) H01L 23/433 (2006.01)

Patent

CA 2106152

A cooling structure which is used for forced cooling of an electronic circuit package is disclosed. The cooling structure comprises a bottom heat radiation plate on which the electronic circuit package is mounted, a nozzle for jetting coolant toward the bottom heat radiation plate, a first vertical heat radiation plate mounted on the bottom heat radiation plate and disposed so as to surround the nozzle, openings formed in the first vertical heat radiation plate for again jetting coolant jetted from the nozzle: and a second vertical heat radiation plate mounted on the bottom heat radiation plate and disposed so as to surround the first vertical heat radiation plate at least in an opposing relationship to the openings. The coolant jetted from the openings collides with and removes heat from the second vertical heat radiation plate.

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