H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 7/20 (2006.01) H01L 23/40 (2006.01) H01L 23/433 (2006.01) H01L 23/538 (2006.01) H01L 25/11 (2006.01) H05K 1/18 (2006.01)
Patent
CA 2055802
A cooling structure for LSI or the like mounted in a small size electronic apparatus, comprising a main printed circuit board (1) mounted thereon first electronic devices (3) with low heat generation; at least an auxiliary printed circuit board (2) mounted thereon â second electronic device (4) with high heat generation and connected with one edge of the main printed circuit board (1) through a flexible printed circuit tape (5); a holder (6) fixed on the main printed circuit board (1) for resiliently supporting the auxiliary printed circuit board (2) at a distance above the former when the latter is turned over and is above the main printed circuit board (1) by bending the flexible printed circuit tape (5) so that a heat conductive surface of the second electronic device (4) is exposed outside. This printed circuit board assembly (A) is accommodated in a housing (B) made of a heat conductive material so that the heat conductive surface of the second electronic device (4) is brought into close and resilient contact with the inner wall (14) of the hosing (B).
Horizoe Haruhiko
Okawachi Mitsuo
Sato Hisato
Yamazaki Naoya
Zenitani Hideki
Fujitsu Limited
Mcfadden Fincham
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