Cooling structure for integrated circuit

Details Cooling structure for integrated circuit Cooling structure for integrated circuit

H - Electricity

01

L

H01L 23/473 (2006.01)

Patent

CA 2088821

Disclosed is a cooling structure in which an integrated circuit is cooled by circulating liquid coolant in the vicinity of the integrated circuit, the structure having a minimum heat resistance between the integrated circuit and the coolant. The structure includes a cooling block having an inlet port and an outlet port for liquid coolant in an upper portion thereof. The block has an opening portion on a side opposed to a heat radiating surface of the integrated circuit and an interior for accumulating the liquid coolant. The opening portion of the block is fixedly secured to the heat radiating surface of the integrated circuit. A nozzle mounted on the inlet port of the cooling block jets the liquid coolant to the heat radiating surface of the integrated circuit.

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