Cooling structure for integrated circuits

Details Cooling structure for integrated circuits Cooling structure for integrated circuits

H - Electricity

01

L

356/110

H01L 23/34 (2006.01) H01L 23/40 (2006.01) H01L 23/473 (2006.01)

Patent

CA 1277777

Abstract of the Disclosure A cooling structure for integrated circuits has integrated circuit cases inside which one or more integrated circuits are mounted, cold plates superposed on heat radiation surfaces of the cases and each having one end thereof bent, and pressing members superposed on the cold plates and each having one end bent to oppose the bent end of the respective cold plate. Each of the cold plates and its respective pressing member are fixed to one or more of the cases in a freely detachable manner and cooling pipes are each held in at least one space formed between an end of one of the cold plates and an end of the corresponding pressing member.

555023

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