Cooling structure for integrated circuits

Details Cooling structure for integrated circuits Cooling structure for integrated circuits

H - Electricity

01

L

H01L 23/433 (2006.01) H01L 23/473 (2006.01)

Patent

CA 2087742

A cooling structure for integrated circuits includes a plurality of integrated circuits and a wiring substrate for mounting the integrated circuits. Cylindrical pistons each have an open upper portion and a spherical lower surface portion which are adapted to be in contact with a heat radiating surface of each of the integrated circuits and a housing has holes formed correspondingly in position to respective said integrated circuits for receiving said pistons respectively. Nozzles are provided for jetting liquid coolant through the open upper portion of each piston into a bottom surface thereof and a cover member is fixedly secured to the housing and has coolant passages for supplying the liquid coolant to the nozzles and discharging the coolant jetted through the nozzles outwardly of the pistons.

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