Cooling structure for multi-chip module

Details Cooling structure for multi-chip module Cooling structure for multi-chip module

H - Electricity

05

K

H05K 7/20 (2006.01) H01L 23/34 (2006.01) H01L 23/467 (2006.01)

Patent

CA 2228486

A cooling structure for a multi-chip module includes a multi-chip module, a fan-builtin heat sink, a cooling fan, and openings. In the multi-chip module, a plurality of chips are mounted on a wiring board. The heat sink has a bottom plate and is arranged above the multi-chip module. The cooling fan is arranged in an upper portion of the heat sink to cool the multi-chip module. The openings are formed in a bottom plate of the heat sink to supply air from the cooling fan to the multi-chip module.

Structure de refroidissement de module multipuce. Comprend un module multipuce, un puits de chaleur à ventilateur intégré, un ventilateur et des orifices. Dans le module multipuce, un certain nombre de puces sont montées sur une carte de connexion. Le puits de chaleur est doté d'une plaque inférieure et disposé au-dessus du module multipuce. Le ventilateur est disposé dans la partie supérieure du puits de chaleur afin de refroidir le module multipuce. Les orifices sont percés dans la plaque inférieure afin de transmettre l'air du ventilateur au module multipuce.

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