H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/112, 253/126
H01L 23/34 (2006.01) C10M 105/54 (2006.01) C10M 105/68 (2006.01) C10M 105/76 (2006.01) C10M 107/38 (2006.01) H01L 23/433 (2006.01)
Patent
CA 2023359
ABSTRACT OF THE DISCLOSURE A cooling system for a semiconductor element comprises a heat flow path including a thermally conductive member interposed between a surface of the element and a surface of a cooling block for conducting heat between them. The member is slidable relative to at least one of the surfaces at a region on of sliding contact. To reduce wear, without reducing thermal conductivity, at the region of sliding contact, at least one of the thermally conductive member and the surface contacted thereby carries a fixed thin film comprising fluorine-containing lubricant, of thickness preferably in the range 2 nm to 100 nm. The fluorine- containing lubricant is chemically bonded to the surface carrying it, or alternately the thin film comprises the fluorine-containing lubricant and a support layer therefor fixed to the surface carrying said thin film, molecules of said lubricant being anchored in the support layer.
Ito Yutaka
Komatsuzaki Shigeki
Morihara Atsushi
Naganuma Yoshio
Nakagawa Yusaku
Hitachi Ltd.
Ito Yutaka
Kirby Eades Gale Baker
Komatsuzaki Shigeki
Morihara Atsushi
LandOfFree
Cooling system for a semiconductor element, semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling system for a semiconductor element, semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling system for a semiconductor element, semiconductor... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1984013