Cooling system for electronic circuit device

H - Electricity – 05 – K

Patent

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356/3

H05K 1/02 (2006.01) H01L 23/433 (2006.01) H05K 7/20 (2006.01)

Patent

CA 1228173

COOLING SYSTEM FOR ELECTRONIC CIRCUIT DEVICE ABSTRACT OF THE DISCLOSURE A cooling module for an electronic circuit component on a printed circuit board includes a passage in which a coolant flows, a first heat transfer plate exposed to the flow of the coolant a second heat transfer plate secured to the circuit component, a compliant member between the first and second heat transfer plates for establishing a compliant contact therebetween, and a bellows connected to the first heat transfer plate to elastically press the same against the circuit component through the compliant member and the second heat transfer plate.

472931

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