H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/3
H05K 1/02 (2006.01) H01L 23/433 (2006.01) H05K 7/20 (2006.01)
Patent
CA 1228173
COOLING SYSTEM FOR ELECTRONIC CIRCUIT DEVICE ABSTRACT OF THE DISCLOSURE A cooling module for an electronic circuit component on a printed circuit board includes a passage in which a coolant flows, a first heat transfer plate exposed to the flow of the coolant a second heat transfer plate secured to the circuit component, a compliant member between the first and second heat transfer plates for establishing a compliant contact therebetween, and a bellows connected to the first heat transfer plate to elastically press the same against the circuit component through the compliant member and the second heat transfer plate.
472931
Katsuyama Kouji
Nakata Mitsuhiko
Sakai Masaaki
Udagawa Yoshiaki
Yamamoto Haruhiko
Fujitsu Limited
Mcfadden Fincham
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