Cooling system for electronics housings

Details Cooling system for electronics housings Cooling system for electronics housings

H - Electricity

05

K

H05K 5/00 (2006.01) B60R 16/023 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2617531

The invention relates to a cooling system, through which liquid flows, for carrying away waste heat for electronics housings, particularly for the automotive industry. According to the invention, the cooling system (1) is adapted to the dimensions of the housing (2). Firstly, the invention advantageously creates an effective cooling system (1) for electronics housings (2) via a number of circuit board levels (6, 7) away with a space- saving compact design. The invention is particularly suited for applications in the automotive industry.

L'invention concerne un système de refroidissement traversé par un liquide, prévu pour dissiper la chaleur perdue et destiné à un boîtier électronique, en particulier au domaine de l'automobile. Selon la présente invention, ce système de refroidissement (1) est adapté à la géométrie du boîtier (2). Cette invention offre, pour la première fois, l'avantage d'un système de refroidissement (1) pour boîtier électronique (2) efficace, sur plusieurs niveaux de carte de circuits imprimés (6, 7), de construction compacte et peu encombrante. Ladite invention s'applique en particulier au domaine de l'automobile.

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