Cooling system for ic package

Details Cooling system for ic package Cooling system for ic package

H - Electricity

01

L

354/221, 62/92

H01L 23/46 (2006.01) H01L 23/433 (2006.01) H01L 23/473 (2006.01)

Patent

CA 1327710

Abstract of the Disclosure A cooling system for an IC package includes a support plate arranged to oppose a wiring board on which a plurality of integrated circuits are mounted, a plurality of cooling plates fixed to the support plate by support members and each having a coolant channel therein, the cooling plates being arranged in a one-to-one correspondence with the integrated circuits, flexible coolant pipes each connecting the coolant channels of adjacent cooling plates, heat conduction members each formed on a surface of each cooling plate, and elastic members disposed between the support plate and the cooling plates to urge the cooling plates against the integrated circuits through the heat conduction members, respectively, thereby independently urging the cooling plates against the corresponding integrated circuits so as to independently cool the integrated circuits.

585054

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