Cooling system for three-dimensional ic package

Details Cooling system for three-dimensional ic package Cooling system for three-dimensional ic package

H - Electricity

01

L

356/110

H01L 23/473 (2006.01) H01L 23/433 (2006.01) H05K 7/20 (2006.01)

Patent

CA 1283225

Abstract of the Disclosure A cooling system for a three-dimensional IC package in which a plurality of substrates each mounting ICs on its one or both surfaces are laminated with a predetermined interval therebetween, includes a cold plate in which holes are formed at positions corresponding to the ICs and a cooling fluid path are formed around the holes, a heat conductive piston, inserted in each hole of the cold plate while keeping a small gap with respect to the inner wall of the hole, and biased by a spring to be moved in the hole, for conducting, when one end thereof is brought into contact with a heat radiating surface of the IC, the heat to the cold plate, and a device for interrupting a contact between the heat conductive piston and the IC so that the substrate can be easily inserted/removed. - 14 -

582329

Affiliated with

Also associated with

Rating

Cooling system for three-dimensional ic package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling system for three-dimensional ic package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling system for three-dimensional ic package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1209653