Cooling systems incorporating heat transfer meshes

Details Cooling systems incorporating heat transfer meshes Cooling systems incorporating heat transfer meshes

H - Electricity

04

B

H04B 10/20 (2006.01)

Patent

CA 2574862

Apparatus for cooling of an electrical element package, comprising in combination: structure including a hollow body, defining a cavity containing cooling fluid, the structure defining an opening or passage whereby direct contact of the cooling fluid with the package is established for heat transfer from the package to the fluid contained in the cavity; a mesh located to enhance the heat transfer, and means for circulating the fluid to transfer heat to other heat transfer means acting to remove heat from the fluid.

L'invention concerne un appareil de refroidissement d'un boîtiers d'éléments électriques se composant d'une structure comprenant un corps creux définissant une cavité contenant le fluide de refroidissement, la structure définissant une ouverture ou un passage au moyen duquel ou de laquelle le contact direct du fluide de refroidissement est établi avec le boîtier pour permettre le transfert de chaleur du boîtier au fluide contenu dans la cavité ; d'une maille positionnée de manière à favoriser le transfert de chaleur et de moyens de circulation du fluide pour transférer la chaleur sur d'autres moyens de transfert de chaleur agissant pour éliminer la chaleur du fluide.

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