Cooling tunnels for semiconductor devices

Details Cooling tunnels for semiconductor devices Cooling tunnels for semiconductor devices

H - Electricity

01

L

347/36, 356/95

H01L 23/34 (2006.01) H01L 23/42 (2006.01) H01L 23/427 (2006.01) H01L 23/473 (2006.01)

Patent

CA 1115822

COOLING TUNNELS FOR SEMICONDUCTOR DEVICES Abstract A structure for cooling high density integrated circuit devices composed of a heat sink bonded to the backside of the integrated circuit devices. The integrated circuit devices are mounted on a board and the board positioned 80 that the tunnels in the heat sink are oriented vertically. The tunnels are totally immersed in a liquid so that the integrated circuit devices are cooled by nucleate boiling and bubbles form within the tunnels and propagate out of the tunnels. FI9-77-066

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