Cooling unit capable of speedily cooling an integrated...

Details Cooling unit capable of speedily cooling an integrated... Cooling unit capable of speedily cooling an integrated...

H - Electricity

01

L

H01L 23/473 (2006.01) H01L 23/433 (2006.01) H01L 23/48 (2006.01)

Patent

CA 2080955

In a cooling unit for use in combination with a cooling medium supplying unit (37) and for cooling at least one integrated circuit chip (31), a heat transfer tube (47) passes a cooling medium and is supported by a hat (21) with a gap left between the tube and the chip. The tube may be electrically conductive and put in contact with an electric conductor bump attached on the chip. The cooling medium supplying unit may comprise a cooling plate (39) having first and second paths (101, 105) for passing the cooling medium. The cooling unit may comprise first and second heat transfer tubes associated with the first and the second paths. Each of the first and the second tubes is supported with the gap left between each of the first and the second tubes and each of first and second chips. The first and the second tubes may be electrically conductive and put in contact with the bumps. The first chip may have primary first and second bumps. The second chip may have secondary first and second bumps. The first tube may be put in contact with the primary and the secondary first bumps. The second tube may be put in contact with the primary and the secondary second bumps.

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