Copolyamide resins having improved creep resistance

C - Chemistry – Metallurgy – 08 – G

Patent

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C08G 69/26 (2006.01) C08G 69/40 (2006.01) C09J 5/06 (2006.01)

Patent

CA 1099447

ABSTRACT OF THE DISCLOSURE Copolyamides derived from a mixture of short-chain and long-chain saturated aliphatic dicarboxylic acids, piperazine and a polyoxyalkylene diamine are excellent hot melt adhesives useful with a variety of sub- strates. These thermoplastic copolyamide resins are particularly useful adhesives for vinyl materials especially plasticized vinyl substrates and are resistant to creep.

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