C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
402/235
C08G 69/26 (2006.01) C08G 69/40 (2006.01) C09J 5/06 (2006.01)
Patent
CA 1099447
ABSTRACT OF THE DISCLOSURE Copolyamides derived from a mixture of short-chain and long-chain saturated aliphatic dicarboxylic acids, piperazine and a polyoxyalkylene diamine are excellent hot melt adhesives useful with a variety of sub- strates. These thermoplastic copolyamide resins are particularly useful adhesives for vinyl materials especially plasticized vinyl substrates and are resistant to creep.
300268
Emery Industries Inc.
Marcus & Associates
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