C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
402/228
C08G 69/36 (2006.01)
Patent
CA 1013093
Halas Francis R.
Rossitto Conrad
LandOfFree
Copolyamides for adhesive use does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Copolyamides for adhesive use, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copolyamides for adhesive use will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-527001