Copolyester resin and resin composition

Details Copolyester resin and resin composition Copolyester resin and resin composition

C - Chemistry, Metallurgy

08

G

402/207

C08G 63/183 (2006.01) C08G 63/199 (2006.01) C08J 5/18 (2006.01)

Patent

CA 2037416

Abstract A copolyester resin is useful for film improving heat-sealing property is produced by polycondensation of (a) terephthalic acid or a dialkyl terephthalate, (b) at least one alkylene glycol having 2 to 8 carbon atoms and (c) a dimer diol comprising as the main component a compound of the following formula (1): Image (1) wherein R1 through R4 are each an unsaturation- free, substantially linear group and, in particular, R1 and R2 each represent an alkyl group and R3 and R4 each represent an alkylene group, the total number of carbon atoms of R1, R2, R3 and R4 being 22 to 34, The film is flexible and colorless.

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