Copolyimide film with improved properties

Details Copolyimide film with improved properties Copolyimide film with improved properties

C - Chemistry, Metallurgy

08

J

C08J 5/18 (2006.01) B29C 39/02 (2006.01) C08G 73/10 (2006.01) H05K 1/03 (2006.01) H05K 3/02 (2006.01)

Patent

CA 2041545

23 TITLE COPOLYIMIDE FILM WITH IMPROVED PROPERTIES ABSTRACT Disclosed is an aromatic copolymidie film prepared by chemical conversion of a copolyamide acid solution obtained by copolymerization of an aromatic tetra- carboxylic acid component comprising from 30 to 50 mole % of biphenyltetracarboxylic acid dianhydride, 50 to 70 mole % of pyromellitic acid dianhydride, 60 to 80 mole % of p-phenylenediamine and 20 to 40 mole % or 4,4- diaminodiphenyl ether. The aromatic copolyimide film has a low coefficient of thermal expansion, low water absorption, a low coefficient of hygroscopic expansion, high mechanical strength and is readily etchable making it suitable for use an advance electronic substrate. 23

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