C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
356/12, 117/185,
C09D 143/04 (2006.01) B32B 15/08 (2006.01) B32B 17/04 (2006.01) C08F 212/32 (2006.01) C08G 61/08 (2006.01) C08J 5/24 (2006.01) H05K 1/03 (2006.01)
Patent
CA 2030259
ABSTRACT OF THE DISCLOSURE Copolymers for use in preparing prepregs, which in turn are used to prepare printed circuit wiring boards are provided, as well as processes for producing the prepregs and wiring boards. The copolymers comprise repeating units derived from cycloolefin monomers, e,g., norbornene-type monomers, e.g., dicyclopentadiene-type monomers. Some of the monomers are silane-substituted while others are non silane-substituted. The silane- substituted monomers provide copolymers which exhibit improved properties when employed as the copolymers in prepregs for printed circuit wiring boards. For example, improved adhesion is achieved between the noncellulosic substrate and the polymers of components used in the wiring boards. These properties include, but are not limited to improved dielectric properties, improved adhesion to glass cloth substrates, etc.
Benedikt George M.
Kettering Timothy J.
Minchak Robert J.
Smith David J.
Tenney Linwood P.
Swabey Ogilvy Renault
The B.f. Goodrich Company
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