Copper alloy compositions

Details Copper alloy compositions Copper alloy compositions

H - Electricity

01

B

H01B 1/22 (2006.01) B22F 1/00 (2006.01) C22C 1/04 (2006.01) C22C 5/08 (2006.01) C22C 9/00 (2006.01) H05K 1/09 (2006.01) H05K 3/12 (2006.01) H05K 3/40 (2006.01) H05K 9/00 (2006.01)

Patent

CA 2055473

A copper alloy composition comprising 100 parts by weight of powder of copper alloy represented by the general formula AgxCuy (wherein x and y are atomic ratio values; 0.001 ? x ? 0.999, 0.001 ? y ? 0.999, x + y = 1), 5 to 200 parts by weight of one or more organic binders and 0.01 to 100 parts by weight of an additive capable of removing copper oxide; and a paste for screen printing, electromagnetic shielding, an electrically conductive additive, a paste for electrode and a paste for through hole, which are obtained by using said composition.

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