Copper alloys for suppressing growth of cu-al intermetallic...

Details Copper alloys for suppressing growth of cu-al intermetallic... Copper alloys for suppressing growth of cu-al intermetallic...

B - Operations, Transporting

23

K

356/183, 13/19

B23K 3/00 (2006.01) B23K 35/00 (2006.01) C22C 9/06 (2006.01) H01L 23/49 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1219104

ABSTRACT Copper alloys are disclosed which may be bonded to aluminum containing members with reduced formation of undesirable copper-aluminum intermetallic compounds. The copper alloys consist essentially of about 15% to about 30% nickel and the balance essentially copper and have particular utility in integrated circuit assemblies as lead frames, lead wires and beam lead tapes. The nickel addition in the alloys suppresses the nucleation rate and the subsequent growth rate of copper-aluminum intermetallic compounds.

445137

Affiliated with

Also associated with

Rating

Copper alloys for suppressing growth of cu-al intermetallic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper alloys for suppressing growth of cu-al intermetallic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper alloys for suppressing growth of cu-al intermetallic... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1318543