Copper alloys with improved solderability shelf life

Details Copper alloys with improved solderability shelf life Copper alloys with improved solderability shelf life

B - Operations, Transporting

22

D

356/183, 13/19

B22D 19/08 (2006.01) B23K 35/00 (2006.01) B32B 15/01 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1218201

10035-MB ABSTRACT A composite structure having improved solder- ability shelf life and contact resistance is formed by coating a copper alloy substrate mateial with a tin-containing material. The copper alloy substrate material consists essentially of about 15% to about 30% nickel and the balance essentially copper. The nickel in the alloy retards the growth of copper- tin and/or copper-zinc-tin intermetallic compounds and the diffusion of the copper through the coating.

445136

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