Copper and copper alloy etching solutions and process

C - Chemistry – Metallurgy – 23 – F

Patent

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149/14, 149/19

C23F 1/02 (2006.01) C23F 1/18 (2006.01)

Patent

CA 1038736

ABSTRACT This invention provides etching solutions for copper and copper alloys comprising a mixed aqueous solution of peroxysulfate with a purine compound and a halogen compound added as the catalyst. There is also provided a process for etching copper or copper alloys with said etching solutions.

209480

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