Copper and copper alloy etching solutions and process

Details Copper and copper alloy etching solutions and process Copper and copper alloy etching solutions and process

C - Chemistry, Metallurgy

23

F

149/14, 149/19

C23F 1/02 (2006.01) C23F 1/18 (2006.01) H05K 3/06 (2006.01)

Patent

CA 1039631

Abstract This invention provides copper and copper alloy etching solutions comprising a mixed aqueous solution of a peroxysulfate with a diazine compound and a halogen compound added as the catalyst. There is also provided a process for etching copper and copper alloys with said etching solutions.

209481

Affiliated with

Also associated with

Rating

Copper and copper alloy etching solutions and process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper and copper alloy etching solutions and process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper and copper alloy etching solutions and process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1105098