Copper base alloys and processing same

C - Chemistry – Metallurgy – 22 – C

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148/35, 75/61

C22C 9/01 (2006.01) C22F 1/08 (2006.01)

Patent

CA 1064737

ABSTRACT OF THE DISCLOSURE Copper base alloys are processed to obtain improved stress corrosion resistance especially for use in severe ammoniacal environments; the process comprises providing a copper base allby consisting essentially of from 1.0 to 4.?% silicon, from 1.0 to 5.0% tin, balance copper, wherein the total silicon plus tin content is at least 3.5%; hot rolling the alloy at a starting temperature in excess of 650°C and within 50°C if the solidus temperature of the alloy, and with a finishing temperature in excess of 400°C; cold rolling the alloy at a temperature below 200°C; and annealing the alloy at a temperature of from 250 to 850°C for from 10 seconds to 24 hours.

237036

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