Copper bath and method of depositing a matt copper coating

Details Copper bath and method of depositing a matt copper coating Copper bath and method of depositing a matt copper coating

C - Chemistry, Metallurgy

25

D

C25D 3/00 (2006.01) C25D 3/38 (2006.01)

Patent

CA 2419595

In the production of printed circuit boards it is required that organic protective coatings adhere tightly on the copper surfaces. Accordingly, matt layers of copper are to be preferred over lustrous coatings. The bath in accordance with the invention serves to deposit matt layers of copper and has the additional advantageous property that the layers may also be deposited with sufficient coating thickness in very narrow bore holes at average cathode current density. For this purpose the bath contains at least one polyglycerin compound selected from the group comprising poly(1,2,3-propantriol), poly(2,3- epoxy-1-propanol) and derivatives thereof.

Dans la production des cartes à circuit imprimé, les revêtements de protection organiques doivent adhérer étroitement sur les surfaces de cuivre. De ce fait, on préfère les couches de cuivre mates aux revêtements brillants. Le bain de cette invention sert à déposer des couches de cuivre mates et possède une propriété intéressante en ce sens que ces couches peuvent aussi être déposées avec une épaisseur de revêtement suffisante dans des petits trous à une densité de tension cathodique moyenne. A cet effet, le bain contient au moins un composé de polyglycérine sélectionné dans le groupe constitué de poly(1,2,3-propantriol), poly(2,3-époxy-1-propanol) et de dérivés de ceux-ci.

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