Copper bath for electroless plating having excess...

Details Copper bath for electroless plating having excess... Copper bath for electroless plating having excess...

C - Chemistry, Metallurgy

23

C

204/170, 117/80,

C23C 18/38 (2006.01) C23C 18/16 (2006.01) C23C 18/40 (2006.01)

Patent

CA 1266401

COPPER BATH FOX ELECTROLESS PLATING HAVING EXCESS COUNTER-CATION AND PROCESS USING SAME ABSTRACT OF THE DISCLOSURE An electroless copper plating bath is improved so as to facilitate its regeneration in an electrodialysis cell. The bath includes elevated amounts of an added salt, preferably as Na salt. The elevated sodium ion level serves as additional counter-cation to hydroxyl ion which is produced at the cathode of the electrodialysis cell. The excess anion from the added salt increases the rate of out-migration of by-products, such as formate ions and sulfate ions, relative to hydroxyl ions through an anion permselective membrane. -31-

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