Copper-chromium-polyimide composite

Details Copper-chromium-polyimide composite Copper-chromium-polyimide composite

C - Chemistry, Metallurgy

25

D

204/18, 356/4

C25D 5/56 (2006.01) H01L 21/48 (2006.01) H01L 23/14 (2006.01) H01L 23/498 (2006.01) H05K 1/03 (2006.01) H05K 3/24 (2006.01) H05K 3/38 (2006.01) H05K 1/00 (2006.01)

Patent

CA 1302947

ABSTRACT OF THE DISCLOSURE A carrier for use in flexible circuits and tape- automated-bonding including a layer of dimensionally stable polyimide film; a layer of metallic chromium vapor-deposited on said polyimide; a layer of copper vapor-deposited on said chromium layer; and a layer of copper electro-deposited on said vapor-deposited copper layer. The chromium deposited on the polyimide affords resistance to undercutting from gold and tin plating baths, and allows conductor to be deposited on both sides of the polyimide.

514849

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