Copper containing algicidal compounds

Details Copper containing algicidal compounds Copper containing algicidal compounds

C - Chemistry, Metallurgy

09

D

C09D 1/02 (2006.01) A01N 59/20 (2006.01) A01P 13/00 (2006.01) C09D 5/14 (2006.01) C09D 7/12 (2006.01)

Patent

CA 2665988

The present application is directed to a coating composition comprising a ceramic binder and inorganic copper compound particles. Generally, the inorganic copper compound particles have a median particle size of less than 5 micrometers. In some embodiments, the particles have a median particle size of greater than 1 micrometer. The inorganic copper compound particles may be non-photocatalytic. The coating may also be placed on a structural layer.

L'application présente porte sur une composition de revêtement comprenant un liant céramique et des particules de composée inorganiques de cuivre. D'une manière générale, lesdites particules ont une taille moyenne de moins de 5 micromètres. Dans certaines exécutions, les particules ont une taille moyenne de plus d'un 1 micromètre. Elles peuvent être non-photocatalytiques. Le revêtement peut aussi être placée sur une couche structurelle.

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