Copper doped low melt solder for component assembly and rework

Details Copper doped low melt solder for component assembly and rework Copper doped low melt solder for component assembly and rework

B - Operations, Transporting

23

K

148/60, 75/91

B23K 35/24 (2006.01) B23K 35/26 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2000301

Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level, below the binary tin-copper eutectic point.

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