Copper electroplating bath including compound with...

Details Copper electroplating bath including compound with... Copper electroplating bath including compound with...

C - Chemistry, Metallurgy

25

D

204/36

C25D 3/38 (2006.01)

Patent

CA 1163953

Abstract of the Disclosure A composition and method for electrodepositing ductile, bright, level copper deposits from an aqueous acidic copper plating bath having dissolved therein a brightening amount of a compound comprising a substituted phthalocyanine radical. In accordance with a preferred embodiment, the composition and method further includes in the copper plating bath secondary brightening agents including aliphatic poly- sulfides and/or organic sulfides and/or polyethers, as well as other known additives for acid copper plating baths.

368435

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