Copper etching process and solution

Details Copper etching process and solution Copper etching process and solution

C - Chemistry, Metallurgy

23

F

149/14

C23F 1/18 (2006.01) C09K 13/04 (2006.01) H05K 3/06 (2006.01)

Patent

CA 1274455

ABSTRACT Process and solution for etching copper, for example, to remove it from printed circuit boards. The etching is effected by an aqueous solution of nitric acid, a polymer which inhibits undercutting of the copper, a surfactant, and sulfuric acid and/or an alkane sulfonic acid such as methane sulfonic acid.

512260

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