Copper foil for the manufacture of printed circuits and...

C - Chemistry – Metallurgy – 25 – D

Patent

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Details

C25D 3/56 (2006.01) H05K 1/09 (2006.01) H05K 3/38 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2227179

A surface of copper foil is protected from oxidation and tarnishing by electrodepositing on the surface a protective layer containing metallic zinc and one or more compounds of trivalent chromium, which protective layer is easily removable by dissolution in a dilute aqueous alkaline solution and which preferably has a zinc to chromium weight ratio of 1:1 or greater. An electrodeposited copper foil especially suited for multilayer printed circuit boards has such a protective layer electrodeposited on the matte side thereof and an electrodeposited copper bonding treatment on the shiny side thereof.

La présente invention consiste à protéger une surface d'une feuille de cuivre de l'oxydation et du ternissement par dépôt électrolytique, sur ladite surface, d'une couche protectrice contenant du zinc métallique et un ou plusieurs composés de chrome trivalent, ladite couche protectrice étant facile à éliminer par dissolution dans une solution alcaline aqueuse diluée et ayant de préférence un rapport en poids zinc-chrome de 1/1 ou plus élevé. Une feuille de cuivre protégée par dépôt électrolytique convenant particulièrement à des plaquettes de circuits imprimés multicouche possède une couche protectrice déposée sur sa surface matte et un traitement de liaison à base de cuivre déposé par électrolyse sur sa surface brillante.

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