Copper metallizations

Details Copper metallizations Copper metallizations

C - Chemistry, Metallurgy

22

C

356/12, 31/98, 7

C22C 1/05 (2006.01) C03C 12/00 (2006.01) H01B 1/16 (2006.01) H05K 1/09 (2006.01)

Patent

CA 1096202

ABSTRACT OF THE DISCLOSURE Copper-based metallizations, which are useful in the electronics art and comprise copper powder and certain alkali metal/lead borosilicate glass powders are disclosed. The copper and glass may be dispersed in an inert liquid vehicle, printed on a substrate, and fired in a nitrogen atmosphere to produce conductor patterns. The fired conductor patterns so obtained are also disclosed.

288566

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