Copper plating process for printed circuit boards

Details Copper plating process for printed circuit boards Copper plating process for printed circuit boards

H - Electricity

05

K

356/12

H05K 3/07 (2006.01) C25D 3/38 (2006.01)

Patent

CA 1142263

COPPER PLATING PROCESS FOR PRINTED CIRCUIT BOARDS ABSTRACT OF THE DISCLOSURE Printed circuit boards are plated with a high acid-low copper sulfate bath which uses a grain refining agent com- prising the extract of regular coffee added in an amount of between 0.1 and 1.0 g/1 of bath solution. The bath is operated at a plating current density of between 15 and 60 asf and a bath temperature in the range of 20° to 40°C.

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