C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/21, 117/92
C25D 5/40 (2006.01)
Patent
CA 1098858
ABSTRACT OF THE DISCLOSURE: Copper based substrates for use at high temperatures in oxidizing atmospheres are made up of a copper core overlaid with a protective nickel oxide barrier layer formed in situ and an external protective layer of nickel. The process for forming the protective nickel oxide barrier layer comprises the steps of sub- jecting the copper core to oxidation to form a cuprous oxide sur- face layer over the copper core, reducing the surface of the cu- prous oxide layer to regenerate copper to regain conductivity, plating a surface layer of nickel over the copper layer, and annealing the coated copper core to scavenge at least some of the oxygen from the cuprous oxide layer and react it at the interface with the plated nickel layer to form the protective nickel oxide barrier layer. The oxidation reduction steps may be carried con- tinuously on a copper core which is moved through a reactor having an oxidation zone fed with oxygen, a reduction zone fed with hydro- gen and a stabilizer zone separating the oxidation and reduction zones and fed with an inert gas. The reactor is maintained at a temperature such as to allow the oxidation and reduction reactions.
306023
Canada Wire And Cable Limited
Primak & Co.
LandOfFree
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