C - Chemistry – Metallurgy – 23 – F
Patent
C - Chemistry, Metallurgy
23
F
31/43, 217/6
C23F 13/00 (2006.01) B65D 81/26 (2006.01) C08K 3/08 (2006.01) C23F 15/00 (2006.01)
Patent
CA 1330389
Abstract Corrosion of metals such as silver and copper by sulfur and chlorine containing entities are substantially prevented by surrounding these materials with a suitable polymeric structure. The structure should be a polymer containing a material such as copper or aluminum that reacts readily with corrosive gases. In one advantageous embodiment a polymer bag containing approximately 35 weight percent of dispersed, powdered copper is employed to enclose a metal containing structure such as a printed circuit board. Use of this expedient substantially reduces corrosion of the printed circuit board.
579383
American Telephone And Telegraph Company
Kirby Eades Gale Baker
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