C - Chemistry – Metallurgy – 22 – C
Patent
C - Chemistry, Metallurgy
22
C
75/1, 13/20
C22C 5/00 (2006.01) C22C 21/00 (2006.01) H01L 23/31 (2006.01) H01L 23/49 (2006.01)
Patent
CA 1223138
ABSTRACT OF THE DISCLOSURE A corrosion-resistant aluminum electronic material comprising an alloy containing aluminum as the principal component and, in addition, a small amount of a noble metal, the content of said noble metal being equal to or less than that at the eutectic point having the primary crystal of aluminum. As the noble metal, there is contained at least one metal selected from Pt, Pd, Rh, Ir, Os, Ru, Au and Ag. Said electronic material is used for ball-bonding wire and distributing film in a semiconductor device, and the like.
434214
Asai Osamu
Hiraga Ryo
Koizumi Masahiro
Onuki Jin
Suwa Masateru
Hitachi Ltd.
Kirby Eades Gale Baker
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