Corrugated matrix heat sink for cooling electronic components

Details Corrugated matrix heat sink for cooling electronic components Corrugated matrix heat sink for cooling electronic components

H - Electricity

05

K

H05K 7/20 (2006.01) F28F 3/06 (2006.01) H01L 23/36 (2006.01) H01L 23/367 (2006.01)

Patent

CA 2352722

An improved heat sink is used to cool electrical and electronic components that generate heat. The heat sink comprises at least one primary corrugated fin pick having a continuous series of vertically extending fins defining channels between adjacent pairs of the vertically extending fins. At least one secondary corrugated fin pack fits within the channels of the primary corrugated fin pack, creating a fin pack matrix. The fin pack matrix is then attached to a base plate.

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