H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/122, 356/193
H01L 21/82 (2006.01) B23K 20/00 (2006.01)
Patent
CA 1211864
Title of the Invention COVER GAS CONTROL OF BONDING BALL FORMATION Abstract of the Disclosure A method and apparatus is disclosed for forming a ball at the end of bonding wire or lead wire held in a capillary wire holding and bonding tool for ball bonding of the lead wire to an integrated circuit chip. The method of ball formation is of the type in which the end of the bonding wire is enclosed in a shroud or shield and the shield and the end of the bonding wire are flooded with an inert cover gas. Ball formation is accomplished by electrically dis- charging an arc between the bonding wire and the shroud for melting and forming the ball at the end of the wire. A passageway is provided for delivering and mixing hydrogen gas into the inert cover gas delivery line at a location upstream from the shroud sufficient for complete mixing. The rate of flow of hydrogen gas is metered and controlled for adjusting the percent by volume of hydrogen in the cover gas mixture to a desired range.
438575
Cousens Donald E.
Kurtz John A.
Fairchild Camera And Instrument Corporation
Smart & Biggar
LandOfFree
Cover gas control of bonding ball formation does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cover gas control of bonding ball formation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cover gas control of bonding ball formation will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1172374