Cover member for sealed circuit board assembly

H - Electricity – 05 – K

Patent

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Details

H05K 9/00 (2006.01) H05K 3/28 (2006.01) H05K 5/06 (2006.01) H05K 7/14 (2006.01)

Patent

CA 2303318

A multi-layered laminate structure forms a cover member that is capable of being sealed around the edges of a circuit board, around connector assemblies mounted on the circuit board, and against a mounting panel to which the circuit board is attached, to provide a sealed environment for electrical components mounted on the circuit board.

Une structure composite à plusieurs couches forme un élément de protection qui peut être scellé autour des bords d'une plaquette de circuit, autour d'ensembles de connexions montés sur la plaquette de circuit et contre un panneau de montage sur lequel est attachée la plaquette de circuit pour constituer un environnement étanche destiné à des composants électriques montés sur la plaquette de circuit.

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