Covered wire connection method and structure

H - Electricity – 01 – R

Patent

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Details

H01R 43/00 (2006.01) H01R 4/00 (2006.01) H01R 4/70 (2006.01) H01R 43/02 (2006.01)

Patent

CA 2217146

Two covered wires conductively connected are overlapped with each other at connection portions. The overlapped connection portions are pinched by a pair of resin chips. By melting cover portions and pressing resin chips from outside, the conductive wire portions of the covered wires are conductively contacted with each other at the connection portions. The pair of the resin chips are melt-fixed to each other to seal the connection portions. A crossing angle .theta. of the two covered wires at the connection portion is set to not less than 45° to not greater than 135°. Thus, the covered wires can be conductively connected with each other at cheap price easily. Further, a connecting state having an excellent electrical characteristic can be obtained stably.

Couplage conductif à recouvrement de deux fils guipés. Les portions de fils couplés par recouvrement sont retenues par une paire de plaquettes de résine. Les plaquettes de résine sont insérées par pression après fusion du guipage des portions de fils à coupler; les conducteurs à l'intérieur des fils guipés sont couplés électriquement au point de couplage par recouvrement. Les plaquettes de résine sont fusionnées l'une à l'autre pour sceller la zone de couplage. L'angle de déphasage théta des deux fils guipés au niveau de la zone de couplage est réglé à non moins de 45 degrés et non plus de 135 degrés. Ainsi, les fils guipés peuvent être couplés électriquement à peu de frais. Outre la stabilité, la connexion obtenue offre possède d'excellentes caractéristiques électriques.

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