H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/3, 356/9
H05K 7/20 (2006.01) H01L 23/40 (2006.01) H01L 23/44 (2006.01) H01L 23/48 (2006.01) H01R 12/16 (2006.01)
Patent
CA 1262288
CRYOGENIC PACKAGING SCHEME Abstract Apparatus and method for removably mounting an integrated circuit package having a plurality of electrical pins wherein a plurality of mating pins each having a receptacle filled with liquid mercury are connected to the electrical pins of the integrated circuit package and the temperature reduced such that the liquid mercury solidifies thereby firmly bonding the electrical pins together. The assembly may be inserted into a Dewar type vessel and covered with a low temperature liquified gas for the dual purpose of solidifying the liquid mercury and cooling the integrated circuit package.
553086
Lauffer Donald K.
Sanwo Ikuo J.
Tipon Donald G.
Lauffer Donald K.
Ncr Corporation
Sanwo Ikuo J.
Smart & Biggar
Tipon Donald G.
LandOfFree
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