Crystal ion-slicing of single-crystal films

H - Electricity – 01 – L

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H01L 21/302 (2006.01) C30B 33/04 (2006.01) C30B 33/08 (2006.01) H01L 21/20 (2006.01) H01L 21/306 (2006.01) H01L 21/762 (2006.01)

Patent

CA 2320218

A method is provided for detaching a single-crystal film from an epilayer (32)/substrate (37) or bulk crystal structure. The method includes the steps of implanting ions (38) into the crystal structure to form a damage layer (36) within the crystal structure at an implantation depth below a top surface of the crystal structure and chemically etching the damage layer to effect detachment of the single-crystal film from the crystal structure. The method of the present invention is especially useful for detaching single-crystal metal oxide films from metal oxide crystal structures.

L'invention concerne un procédé de détachement d'un film monocristallin à partir d'un substrat (37)/couche épitaxiale (32) ou d'une structure cristalline non épitaxiée, comprenant les étapes consistant à implanter des ions (38) dans la structure cristalline, afin de former, dans cette structure, une couche endommagée (36), à une profondeur d'implantation située en dessous d'une surface supérieure de la structure cristalline, puis à attaquer chimiquement cette couche endommagée, afin d'exécuter le détachement du film monocristallin à partir de la structure cristalline. Le procédé de l'invention est notamment utile pour détacher des films d'oxydes métalliques monocristallins à partir de structures cristallines d'oxydes métalliques.

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