Cu-mo substrate and method for producing same

Details Cu-mo substrate and method for producing same Cu-mo substrate and method for producing same

H - Electricity

01

L

H01L 23/14 (2006.01) H01L 23/373 (2006.01) H01L 25/07 (2006.01) H01L 25/18 (2006.01)

Patent

CA 2609252

A Cu-Mo substrate 10 according to the present invention includes: a Cu base 1 containing Cu as a main component; an Mo base having opposing first and second principal faces 2a, 2b and containing Mo as a main component, the second principal face 2b of the Mo base 2 being positioned on at least a portion of a principal face la of the Cu base 1; and a first Sn-Cu-type alloy layer 3 covering the first principal face 2a and side faces 2c and 2d of the Mo base 2, the first Sn-Cu-type alloy layer 3 containing no less than 1 mass% and no more than 13 mass% of Sn.

L~invention concerne un substrat à base de Cu et de Mo (10) comprenant un matériau à base de Cu (1) contenant Cu en tant que composant principal, un matériau à base de Mo (2) contenant Mo en tant que composant principal et ayant des première et seconde surfaces principales (2a, 2b) opposées l~une par rapport à l~autre, et une première couche d'alliage Sn-Cu (3) recouvrant la première surface principale (2a) et les surfaces latérales (2c, 2d) du matériau à base de Mo (2). La seconde surface principale (2b) du matériau à base de Mo (2) est disposée sur au moins une partie d'une surface principale (1a) du matériau à base de Cu (1), et la première couche d'alliage Sn-Cu (3) ne contient pas moins de 1 % en masse et pas plus de 13 % en masse de Sn.

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