C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
167/325, 402/403
C09J 133/00 (2006.01) A61K 6/00 (2006.01) A61K 6/08 (2006.01) A61K 6/083 (2006.01) C09J 4/00 (2006.01)
Patent
CA 1327865
ABSTRACT OF THE DISCLOSURE A curable adhesive composition for use as adhesive for a dental composite resin is provided, comprising in combination, (i) a solution containing a radical polymerizable acrylate or methacrylate monomer having at least one group selected from the class consisting of a hydroxyalkyl, hydroxyalkylene, amide, oxyalkylene, and polyoxyalkylene group in its molecule, and (ii) a curable composition comprising (P) a monofunctional (meth)acrylate monomer, (Q) a polyfunctional (meth)acrylate monomer, (R) a (meth)acrylate monomer containing an acidic group and at least one (meth)acryloyloxyl group in its molecule, and (S) a trialkylboron or an oxide thereof.
560794
Ito Kazuo
Sakashita Takeshi
Wakumoto Sadao
Kirby Eades Gale Baker
Mitsui Chemicals Incorporated
LandOfFree
Curable adhesive compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Curable adhesive compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Curable adhesive compositions will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1171833